Products

TEA offers a comprehensive range of thermal test and measurement products for the semiconductor industry. Click any product category below to learn more.

• Scalability: any chip size (1mm x 1mm, to >50mm x 50mm)
• Configurability: hot spots (as small as 1mm x 1mm)
• In-situ TSD (temperature sensing diode), in every 1mm x 1mm area
  – very different from RTD
• Power density exceeds requirements for HPC and AI chips
• Conforms to JEDEC standards
• Can be configured into various power zones (“hot spots”), with temperature sensors at desired locations across the chip
• Complexity: various packaging formats – WB, FC, COB, BGA, LGA, multi-chip SiP, stacked/3D
• Flexibility: can integrate with any thermal management solutions, with various die backside metallization options
• Can enable thermal studies – transient or steady state
• Can interface with commonly available instrumentation
• Can be utilized in advanced packaging configurations: 2.5D/3D (TSV, HB), embedded (organic, glass, RDL), …

Thermal Test Chips

Thermal Test Vehicles

Thermal Test Boards

Thermal Load Boards

TTC Thermal Measurement Systems

TIM Characterization Tools

TIM Measurement System

Thermal Test System

For special requirements beyond our standard offerings, please contact us.