Thermal Engineering Associates, Inc.

Technical Briefs

These short documents provide general information on the thermal testing of semiconductor devices. All documents are available as PDF downloads unless otherwise noted.

TB-01Measuring the Thermal Resistance of Semiconductor Devices

TB-02Using Diodes as Temperature Sensors in Semiconductor Thermal Measurement

TB-03Semiconductor Thermal Measurement Procedures

TB-04Heating and Cooling Curves in Thermal Characterization

TB-05Thermal Resistance Definitions for Semiconductor Packages

TB-06Heating Curve Analysis Techniques

TB-07Thermal Test System Selection Guidelines

TB-08Diode Sensor Calibration Approaches

TB-09Thermal Characterization of Power Transistors

TB-10Thermal Characterization of LED Arrays

TB-11Thermal Characterization of Transistor Modules

TB-12Temperature Diode Matrices for Thermal Mapping

TB-13Thermal Conductivity Measurements of Materials

TB-14Bond Line Thickness Corrections in TIM Measurements

TB-15TIM Thermal Conductivity Characterization

TB-16Kelvin Connections in Thermal Measurement

TB-17Diode Matrix Operation for Thermal Characterization

TB-18

1mA Current Source Reference Design (available by email request: info@thermengr.com)

TB-19ACOL Burn-In Monitoring Techniques

TB-20Thermal Test Chip Packaging Considerations

TB-21IC Thermal Measurement Methods

TB-24Advanced Thermal Characterization Techniques

For questions about technical briefs or to request additional information, please contact TEA.