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Thermal Measurement Standards

The following standards are relevant to semiconductor thermal testing and characterization. TEA products and services are designed to facilitate and support compliance with many of the standards where applicable. Click any standard to view or download it.

JEDEC Standards

JESD51Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
JESD51-1Integrated Circuit Thermal Measurement Method — Electrical Test Method (Single Semiconductor Device)
JESD51-2AIntegrated Circuits Thermal Test Method Environmental Conditions — Natural Convection (Still Air)
JESD51-3Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-4AThermal Test Chip Guidelines (Wire Bond & Flip Chip)
JESD51-5Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms
JESD51-6Integrated Circuit Thermal Test Method Environmental Conditions — Forced Convection (Moving Air)
JESD51-7High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-8Integrated Circuit Thermal Test Method Environmental Conditions — Junction-to-Board
JESD51-9Test Boards for Area Array Surface Mount Package Thermal Measurements
JESD51-10Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
JESD51-11Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements
JESD51-12Guidelines for Reporting and Using Electronic Package Thermal Information
JESD51-13Glossary of Thermal Measurement Terms and Definitions
JESD51-14Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case
JESD15Thermal Modeling Overview
JESD15-1Compact Thermal Model Overview
JESD15-3Two-Resistor Compact Thermal Model Guideline
JESD15-4DELPHI Compact Thermal Model Guideline

SEMI Standards

G30-88Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages
G32-87Guideline for Unencapsulated Thermal Test Chip
G38-87/96Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements
G42-96Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance
G43-87Test Method for Junction-to-Case Thermal Resistance Measurements of Molded-Plastic Packages
G46-88Test Method for Thermal Transient Testing for Die Attachment Evaluation
G68-96Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment

Military Standards

MIL-STD-750 Method 3101Thermal Impedance (Response) Testing of Diodes
MIL-STD-750 Method 3103Thermal Impedance Measurements of Insulated Gate Bipolar Transistors (IGBT)
MIL-STD-750 Method 3104Thermal Impedance Measurements of GaAs MESFETs
MIL-STD-750 Method 3131Thermal Resistance Measurements of Bipolar Junction Transistors
MIL-STD-750 Method 3161Thermal Impedance Measurements for Vertical Power MOSFETs
MIL-STD-883 Method 1012Thermal Characteristics of Integrated Circuits

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For assistance with standards compliance, please contact TEA.