Thermal Engineering Associates, Inc.
650-961-5900  •  info@thermengr.com  •  Santa Clara, CA

News & Blogs

Technical Blogs

2026High Thermal Conductivity Dry Film Solder Resist: Steady-State Thermal Validation
2026Development of Microelectronics Thermal Management Laboratory for Extreme Environments
November 19, 2025Silicon TTV for Advanced Thermal Investigations of High Powered Lidless Package AI Silicon
November 11, 2025Experimental Demonstration of Segmented Vertical Cooling for Silicon Dielets
June 15, 2025TTV for Thermal Characterization of Materials
June 1, 2025TEA TTV Differentiation
May 10, 2025Thermal Test Vehicle for Transient Thermal Characterization of Large Body Size Chips
July 26, 2024Thermal Characterization for AI Chips
February 14, 2024Rapid Development and Optimization of Thermal Management Solutions for Advanced Semiconductor Packaging
November 5, 2023Thermal Test Vehicles for Thermal Management Solutions
August 16, 2023Thermal Test Chips (TTCs) for Advanced Semiconductor Packaging
August 9, 2023TEA TTCs Used in Research at Georgia Tech for Advanced Packaging
April 10, 2023Thermal Twins for Developing Thermal Management Solutions

Press Releases

June 8, 2010TEA Introduces New Thermal Test Vehicles for Advanced Packaging
February 16, 2010TEA Announces Mechanical Integrity Test Vehicle
September 22, 2009TEA Introduces TIM Characterization Tools for Semiconductor Packages
March 17, 2009TEA Announces JEDEC-Compliant Thermal Test Chips