TEA's TIM Measurement System is a dedicated platform for evaluating Thermal Interface Material performance, providing accurate thermal conductivity and resistance measurements across a wide range of TIM materials and conditions.

The system enables engineers to characterize TIM materials under realistic compressive loads and temperatures, producing reliable data for material selection and process optimization.

Capabilities

• Accurate thermal conductivity measurement
• Thermal resistance measurement at controlled bond line thickness
• Configurable compressive load and temperature conditions
• Supports a wide range of TIM materials (greases, pads, phase-change, solders)
• Repeatable, standardized measurement protocol