TEA's Thermal Load Boards (TLBs) provide controlled thermal stress to semiconductor packages and assemblies for characterization and reliability testing. The TLBs are designed to apply precise, uniform, and repeatable thermal loads to devices under test.

TLBs are used in conjunction with TEA's measurement systems to characterize thermal performance across a range of power levels and environmental conditions.

Applications

• Controlled thermal stress testing
• Thermal resistance characterization under load
• TIM performance evaluation under realistic conditions
• Reliability and burn-in testing