Thermal Test Chips (TTCs)
TEA's Thermal Test Chips (TTCs) are silicon devices used for:
- Chip/Package thermal characterization
- Heat source emulation
- Temperature reference platforms
- Steady state and transient thermal analysis
- Power and temperature mapping
- System thermal management design
- Materials characterization; Thermal interface material (TIM) measurement
- Cooling module characterization
TEA employs a modular Unit Cell concept as the basic building block for the TTCs. Each Unit Cell integrates heating resistors and temperature sensing diodes (TSD), allowing arrays to closely approximate various application sizes and power distributions.
Available Products
1mm × 1mm Unit Cell. Available in wafer and chip formats.
2.54mm × 2.54mm Unit Cell. Available in wafer and chip formats.
Custom single and multiple chip packaging options are also available. Contact us for more information.