TTC-1002 Thermal Test Chip
2.54mm × 2.54mm Unit Cell Arrayable Thermal Test Chip
The TTC-1002 is a 2.54mm × 2.54mm Unit Cell arrayable Thermal Test Chip. Its larger Unit Cell size is ideal for characterizing larger semiconductor chips, packages, assemblies, and module-level thermal behavior.
Each Unit Cell integrates heating resistors and temperature sensing diodes (TSD). The 2.54mm pitch corresponds to industry-standard grid spacings, making the TTC-1002 especially suitable for socket-based and BGA package characterization.
TTC-1002 Unit Cell
Key Features
- Unit Cell size: 2.54mm × 2.54mm
- Integrated heating resistors (2) and diode temperature sensors (4) in each Unit Cell
- Arrayable to emulate various chip sizes
- Available in wafer and singulated chip formats
- Custom packaging options available
Applications
- Thermal design characterization and validation
- Package thermal resistance (θJA, θJC, θJB) measurement
- Thermal transient analysis
- TIM characterization
- Cooling solution characterization and validation
- Thermal simulation model calibration
- Calibration of thermal measurement tools (e.g., optical, …)
TTC-1002 in a 3×3 array configuration
For a TTC-1002 datasheet, please click here.
For TTC-1002 Wafer & Chip Requirements Questionnaire,
please click here.
(Use this document for communicating
your specific requirements to TEA.)