TTC-1001 Thermal Test Chip
1mm × 1mm Unit Cell Arrayable Thermal Test Chip
The TTC-1001 is a 1mm × 1mm Unit Cell arrayable Thermal Test Chip. Its small Unit Cell size allows dense arrays to closely emulate real-world chip power distributions and precisely characterize thermal behavior in advanced semiconductor packages.
Each Unit Cell integrates heating resistors and temperature sensing diodes (TSD). Multiple Unit Cells can be arrayed to approximate the size and power distribution of actual production die.
Key Features
- Unit Cell size: 1mm × 1mm
- Integrated heating resistors and diode temperature sensors
- Arrayable to emulate various chip sizes
- Available in wafer and singulated chip formats
- Custom packaging options available
Applications
- Thermal design characterization and validation
- Package thermal resistance (θJA, θJC, θJB) measurement
- Thermal transient analysis
- TIM characterization
- Cooling solution characterization and validation
- Thermal simulation model calibration
- Calibration of thermal measurement tools (e.g., optical, …)
TTC-1001 in a 2×2 array configuration
For a TTC-1001 datasheet, please click here.
For TTC-1001 Wafer & Chip Requirements Questionnaire,
please click here.
(Use this document for communicating
your specific requirements to TEA.)