Thermal Test Vehicles (TTVs)

TEA's Thermal Test Vehicles (TTVs) are complete assembled test vehicles designed for thermal evaluation of semiconductor packages and systems. TTVs integrate TEA's thermal test chips with appropriate substrate, package, and assembly elements to provide a realistic thermal test environment.

TTVs are available in multiple configurations to accommodate different package types, sizes, and test requirements — from single-chip to multi-chip designs. Various chip configurations (die size, thickness and back-side treatment) are optionally available on a custom basis. Various power zones and hot spots can be configured in each TTC of the TTV package, with in-situ temperature sensors at various locations across the die, with resolution down to 1mm x 1mm, as needed.

A brochure of TEA product family of Thermal Test Vehicles can be found here.

Application information can be downloaded here.

Larger chip sizes, package types and multi-chip configurations are also available on a custom basis.

For specifications, pricing, or to discuss custom TTV configurations, contact TEA.