TEA's TIM (Thermal Interface Material) Characterization Tools enable precise measurement and analysis of thermal interface material performance in realistic semiconductor package environments.

The TTV-410X family of test vehicles is specifically designed for TIM characterization, providing controlled mechanical loading, accurate temperature measurement, and repeatable bond line thickness control.

For more information on TIM Characterization Tools, please click here.

TTV-410X Features

• Controlled die-to-lid or die-to-heat-spreader TIM evaluation
• Accurate and repeatable bond line thickness control
• Compatible with TEA TTC-based measurement systems
• Configurable for different package sizes

Application information can be downloaded here.