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Phone: 650-961-5900
FAX: 650-227-3814
Santa Clara, CA, USA

Thermal Test Vehicles

Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization,  and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.

The TTVs are 27mm X 27mm BGA packages with 1mm pitch, 0.6mm diameter balls in a partially populated 26X26 array (480 balls). Twelve strategically placed ball sets are available for daisy-chain applications.

TTV-1100 series (for odd arrays)

    Available in versions with three different TTC array sizes –

      TTV-1101 1X1 (2.5X2.5mm)

      TTV-1102 3X3 (7.65X7.65mm)

      TTV-1103 5X5 (12.8X12.8mm)

·  TTV-1200 series (for even arrays)

    Available in versions with two different TTC array sizes –

      TTV-1201 2X2 (5.08X5.08mm)

      TTV-1202 4X4 (10.23X10.23mm)


The chips on these TTVs are from available inventory of different thickness and backside metallization. Other array sizes and configurations, thickness and back-side treatment are optionally available on a custom basis.

Larger array (chip) sizes, package types and multi-chip configurations are also available on a custom basis. Please contact TEA  to discuss specific environments.